Industry Directory | Manufacturer
Nitrogen Hot Air Circulation Reflow, Screen Printer, Wave Soldering, Double Unloader, Inverter Machine, 90° PCB Transfer Buffer Loader & Unloader
Industry Directory | Manufacturer
FAROAD, located in Shenzhen, China, has been acting professionally in SMT EQUIPMENT manufacture from the year 2006, concentrating on providing the finest quality equipment at an affordable price.
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Refurbished NXT-III 2xM3III (2 x H24S Head) FUJI SMT Pick and Place Machine Specification of FUJI AIMEX III SMT SMD Pick and Place Machine MC Model M3 III M6 III Applicable PCB size (LxW) 48 x 48 mm to 250 x 510 mm (dou
SMT peripheral equipment mainly refers to: printing press, docking station, Mounter, reflow soldering, AOI, wave soldering and other equipment. SMT peripheral technology is similar to the original hyper threading technology. Users who have experienc
Electronics Forum | Thu Jun 22 11:01:54 EDT 2000 | Chrys Shea
Jason, Double sided reflow should be no problem. People have been doing it for years. The surface tension of the molten solder will hold the components on the bottom side during your second pass. This is almost always the case, unless you have re
Electronics Forum | Thu Jun 22 11:02:13 EDT 2000 | Chrys Shea
Jason, Double sided reflow should be no problem. People have been doing it for years. The surface tension of the molten solder will hold the components on the bottom side during your second pass. This is almost always the case, unless you have re
Used SMT Equipment | Pick and Place/Feeders
Brand: FUJI Name: FUJI Scalble Placement Platform NXT Ii Module Width: 320mm Machine Dimensions: L：1295mm（M3 II×4, M6 II×2） Lntelligent Feeders: Support For 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, And 104 Mm Wide Tape Trays: Applicable Tr
Used SMT Equipment | Pick and Place/Feeders
FUJI-NXT III NXT III Scalable Placement Platforms The NEW NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips
Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Industry News | 2022-12-14 12:21:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Parts & Supplies | Pick and Place/Feeders
Equipment introduction: Fuji mounter AIMEX II: Fuji mounter AIMEX II is a multi-functional integrated mounter for various production forms from trial production to mass production. It has a large-capacity material station capable of carrying various
Technical Library | 2015-03-19 20:33:34.0
Silicon is arguably the best electronic material, but it is not a good optoelectronic material. By employing first-principles calculations and the cluster-expansion approach, we discover that hydrogenated bilayer silicene (BS) shows promising potential as a new kind of optoelectronic material. Most significantly, hydrogenation converts the intrinsic BS, a strongly indirect semiconductor, into a direct-gap semiconductor with a widely tunable band gap. At low hydrogen concentrations, four ground states of single- and double sided hydrogenated BS are characterized by dipole-allowed direct (or quasidirect) band gaps in the desirable range from 1 to 1.5 eV, suitable for solar applications. At high hydrogen concentrations, three well-ordered double-sided hydrogenated BS structures exhibit direct (or quasidirect) band gaps in the color range of red, green, and blue, affording white light-emitting diodes. Our findings open opportunities to search for new silicon-based light-absorption and light-emitting materials for earth-abundant, high efficiency, optoelectronic applications.Originally published by the American Physical Society
Technical Library | 2021-08-04 18:41:30.0
Industry 4.0 is one of the most exciting developments in the manufacturing industry in decades. It promises vast improvements for both manufacturers and their customers. For some companies, however, it can be overwhelming, and it can be difficult with the current available information to understand exactly what the benefits will be in the average factory, and to calculate the return on the investment. Therefore, it may be helpful to bring the discussion down to a tangible level and to isolate one little part of the whole smart electronic assembly factory, namely reflow.
FUJI SMT Pick and Place Machine NXT III If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine,
FUJI M6 III High Speed Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place ma
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | , | Engineering,Production
Manufacturing Engineer - AOI Will develop, implement, and maintain PCB assembly processes including screen printing, placement, reflow, and automated optical inspection. Will be process owner for AOI equipment. Requires: BS Engineering Th
Career Center | Derabassi, India | Maintenance,Management,Production,Quality Control,Sales/Marketing
PCB Assembly (SMT & PTH)--Process/Planning – Production – Maintenance/Troubleshooting – QA/QC
Career Center | chennai, Tamil nadu India | Engineering,Production
KEY SKILLS; 1.PRINTING, PICK AND PLACE MACHINE OPERATION, 2.REFLOW OVEN CHARACTERISTICS, 3.IPC STANDARD,QUALITY POLICIES 4.AOI PROGRAMMING 5.c,c++LANGUAGES. 6.VerilogHDL. 7.ORCAD,PSPICE software known.
Featured Article Return to Front Page REFLOW SOLDERING
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